Heat Sinks Thin-Fin Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x25.4x25.4mm
Products specifications
| Product | Heat Sinks |
| Width | 25.4 mm |
| Height | 0.33 mm |
| Designed for | BGA, PGA, QFP |
| Heatsink Material | Copper |
| Mounting Style | Adhesive |
| Length | 101.6 mm |