Heat Sinks Thin-Fin Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x38.1x38.1mm
Products specifications
|
Product
|
Heat Sinks |
|
Mounting Style
|
Adhesive |
|
Heatsink Material
|
Copper |
|
Width
|
38.1 mm |
|
Length
|
101.6 mm |
|
Designed for
|
BGA, PGA, QFP |
|
Height
|
0.33 mm |