Heat Sinks Thin-Fin Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x38.1x38.1mm
Products specifications
| Product | Heat Sinks |
| Mounting Style | Adhesive |
| Heatsink Material | Copper |
| Width | 38.1 mm |
| Length | 101.6 mm |
| Designed for | BGA, PGA, QFP |
| Height | 0.33 mm |