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      • Littelfuse TP1.5KE18CA
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            • Taiyo Yuden LMK316BC6476ML-T
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            • KEMET C440C103K5G5TA
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        • Adafruit 4431
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        • OSEPP Electronics REED-01
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        • ADLINK Technology SATA Power to B4P cable
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        • Vishay Semiconductors TSOP95336TR
      • Infrared Transceivers
  • ON Semiconductor LM324
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      • Littelfuse TP1.5KE18CA
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      • Racks & Rack Cabinets
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      • Time Delay & Timing Relays
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  • LED Lighting
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      • LED Heat Sinks
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      • Thermal Substrates - MCPCB
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      • CCFL Fluorescent Lamps
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  • Passive Components
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    • Antennas
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      • Antennas
      • Pulse Electronics GPSDM700/5800SSS
      • STMicroelectronics BLUENRG-M2SP
      • TE Connectivity 2344657-1
    • Audio Transformers / Signal Transformers
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      • Audio Transformers / Signal Transformers
    • Capacitors
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      • Aluminum Electrolytic Capacitors
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        • MLCCs - Multilayer Ceramic Capacitors
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          • Multilayer Ceramic Capacitors MLCC - SMD/SMT
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            • KEMET C0805C104K5RAC7411
            • KEMET CAN13X682JAGACTU
            • KEMET CAN13X682JAGACTU
            • Taiyo Yuden LMK316BC6476ML-T
            • Walsin 2220N123J500CT
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          • Multilayer Ceramic Capacitors MLCC - Leaded
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            • KEMET C440C103K5G5TA
            • KEMET C440C103J1G5CA
        • Ceramic Disc Capacitors
        • Capacitor Arrays & Networks
      • Feed Through Capacitors
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    • D10650-40T4E
    Picture of D10650-40T4E
    Manufacturer: Wakefield-Vette

    D10650-40T4E

    Heat Sinks Deltem Composite Pin Fin Heat Sink, 16.5x10.2mm, Chomerics T410R
    Lead Time: 84 Days
    SKU: D10650-40T4E
    Availability: 24 in stock
    PRICE BREAKS - The more you buy, the more you save
    Quantity
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    26+
    260+
    520+
    1014+
    2522+
    Price
    R 179.42
    R 164.30
    R 125.60
    R 124.32
    R 122.52
    R 120.47
    Free shipping
    • Overview
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    Heat Sinks Deltem Composite Pin Fin Heat Sink, 16.5x10.2mm, Chomerics T410R
    Lead Time: 84 Days
    Products specifications
    ProductHeat Sinks
    Designed forBGA Semiconductors
    Mounting StyleAdhesive
    Fin StyleOmnidirectional Fin
    Heatsink MaterialComposite
    *
    *
    *
    Products specifications
    ProductHeat Sinks
    Designed forBGA Semiconductors
    Mounting StyleAdhesive
    Fin StyleOmnidirectional Fin
    Heatsink MaterialComposite
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