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      • Littelfuse TP1.5KE18CA
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            • Taiyo Yuden LMK316BC6476ML-T
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            • KEMET C440C103K5G5TA
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        • Adafruit 4431
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        • OSEPP Electronics REED-01
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        • ADLINK Technology SATA Power to B4P cable
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        • Vishay Semiconductors TSOP95336TR
      • Infrared Transceivers
  • ON Semiconductor LM324
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      • Littelfuse TP1.5KE18CA
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      • Racks & Rack Cabinets
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      • Time Delay & Timing Relays
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  • LED Lighting
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      • LED Heat Sinks
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      • Thermal Substrates - MCPCB
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      • CCFL Fluorescent Lamps
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  • Passive Components
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    • Antennas
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      • Antennas
      • Pulse Electronics GPSDM700/5800SSS
      • STMicroelectronics BLUENRG-M2SP
      • TE Connectivity 2344657-1
    • Audio Transformers / Signal Transformers
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      • Audio Transformers / Signal Transformers
    • Capacitors
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      • Aluminum Electrolytic Capacitors
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        • MLCCs - Multilayer Ceramic Capacitors
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          • Multilayer Ceramic Capacitors MLCC - SMD/SMT
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            • KEMET C0805C104K5RAC7411
            • KEMET CAN13X682JAGACTU
            • KEMET CAN13X682JAGACTU
            • Taiyo Yuden LMK316BC6476ML-T
            • Walsin 2220N123J500CT
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          • Multilayer Ceramic Capacitors MLCC - Leaded
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            • KEMET C440C103K5G5TA
            • KEMET C440C103J1G5CA
        • Ceramic Disc Capacitors
        • Capacitor Arrays & Networks
      • Feed Through Capacitors
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    Comparing Backplane Connectors: VME, CompactPCI, and VPX

    03 December 2025

    Estimated Reading Time: 8 minutes

    Key Takeaways

    • VME, CompactPCI, and VPX form factors each suit different system architectures and performance requirements.
    • Pin count and pitch specifications vary significantly across connector families from TE Connectivity, Amphenol, ITT Cannon, Molex, and Harting.
    • Contact material and plating options determine connector performance in industrial environments.
    • High-speed applications beyond 25 Gbps require specific impedance control and stub length considerations.
    • Working with reliable backplane connector suppliers in South Africa ensures consistent component availability.

    Evaluating Backplane Connector Form Factors

    When specifying backplane connectors for multi-board systems, the form factor decision shapes the entire system architecture. VME connectors utilise DIN 41612 standards with 96 or 160 pin configurations, providing proven mechanical reliability in industrial and military applications. Harting's DIN 41612 right-angle connectors offer 160-position configurations suited to legacy system integration and retrofit projects.

    CompactPCI connectors adapt PCI bus technology to industrial form factors whilst maintaining robust mechanical properties. The standard incorporates hot-swapping capabilities, allowing card replacement without system shutdown. Amphenol produces CompactPCI solutions particularly prevalent in European industrial automation installations.

    VPX (VITA 46) represents current-generation high-performance backplane technology. The architecture supports modern serial protocols including PCI Express and 10 Gigabit Ethernet, making it appropriate for radar systems, telecommunications infrastructure, and high-frequency trading platforms where data rates exceed 25 Gbps per differential pair.

    Pin Count and Pitch Specifications

    Backplane connector modules vary widely in pin count depending on application requirements. Basic power distribution backplanes typically use 30-50 pins, whilst complex telecommunications systems may require 400 or more pins per connector. Higher pin counts accommodate additional power planes, ground connections, and signal paths.

    Pitch specifications present distinct trade-offs. Standard 2.54mm pitch connectors provide straightforward insertion and extraction with minimal tooling requirements. High-density applications often specify 2.0mm or 1.27mm pitch connectors to maximise signal density in constrained board space. ITT Cannon's DL Series connectors offer 96-position configurations with 2.54mm pitch, balancing density with mechanical reliability for industrial backplane applications.

    Tighter pitch demands more precise manufacturing tolerances and can complicate field maintenance. Crosstalk between adjacent pins increases as spacing decreases, requiring careful attention to ground pin placement and signal routing. Engineers must weigh density benefits against design complexity required to maintain signal integrity.

    Manufacturer Product Characteristics

    TE Connectivity specialises in high-reliability aerospace and military applications, with extensive qualification testing and long-term availability programmes. Their connectors feature in systems requiring extended service life where field failures carry significant operational consequences. TE Connectivity's power distribution connectors offer wire-to-board configurations suited for backplane power applications.

    Amphenol focuses on telecommunications and datacom infrastructure. Their backplane solutions emphasise high-speed signal integrity and thermal management, essential for networking switches and routers operating at multi-gigabit speeds in temperature-controlled environments.

    ITT Cannon produces ruggedised solutions for harsh industrial environments. Their connectors incorporate enhanced vibration resistance and sealed contact systems, making them suitable for manufacturing automation and transportation applications with frequent insertion cycles.

    Molex offers broad product coverage spanning consumer electronics to industrial automation. Their MiniFit Jr and Micro-Fit connector families provide wire-to-board configurations for power distribution in backplane applications, with designs that simplify assembly and field service procedures.

    Harting manufactures DIN 41612 connectors widely used in VME and industrial backplane systems. Their connectors provide robust mechanical performance and are particularly suited for legacy system integration where standardised pin configurations are required.

    Contact Material and Plating Options

    Contact material selection impacts connector performance across the product lifetime. Phosphor bronze contacts provide good spring characteristics for lower-speed applications. Beryllium copper offers superior electrical conductivity and mechanical durability for high-cycle insertion applications.

    Plating selection depends on the operating environment and performance specifications. Gold plating provides excellent corrosion resistance and low contact resistance for high-reliability applications. Typical specifications call for 1.27-2.54 microns of gold over 1.27 microns of nickel underplate. Tin plating offers an alternative for less demanding applications, though it shows greater susceptibility to fretting corrosion in vibration-prone installations.

    Industrial environments with chemical exposure, high humidity, or temperature extremes require connectors with robust plating systems. Explore our backplane connectors to find the right solution for your system architecture.

    High-Speed Signal Integrity Considerations

    Modern backplane applications operating beyond 25 Gbps require connectors designed as transmission line elements rather than simple mechanical connections. Controlled impedance, typically 85-100 ohms differential, must be maintained throughout the connector body to minimise signal reflections.

    Stub length affects high-speed performance significantly. The distance from the active signal path to unused connector pins creates reflections that can corrupt data at multi-gigabit rates. Advanced connector designs from TE Connectivity and Amphenol incorporate low-stub or stub-free architectures, where unused pins are eliminated or designed to minimise electrical impact.

    Differential signalling has become standard for high-speed backplane applications. Connectors must maintain tight pair-to-pair spacing and balanced electrical characteristics to preserve signal quality across the transmission path.

    Frequently Asked Questions

    1. How do I select the appropriate pin count for my application?

    Start by calculating power requirements and allocating sufficient pins for power and ground connections. Then account for all required signal paths, including data, control, and auxiliary signals. Consider adding spare pins for future expansion. A 96-position connector like the ITT Cannon DL Series typically allocates pins across power distribution, signal transmission, and reserve capacity.

    2. What should I look for when selecting backplane connector suppliers in South Africa?

    Evaluate supplier inventory depth, lead times, and technical support capabilities. Reliable backplane connector suppliers in South Africa like TRX Electronics maintain stock of common connector families from manufacturers like TE Connectivity, Amphenol, ITT Cannon, Molex, and Harting. Weekly backorder reports keep you informed of supply chain status. TRX Electronics maintains partnerships with leading manufacturers and provides prompt quote turnaround times for project planning.

    3. Can I mix different connector types within the same system?

    Whilst technically feasible, mixing connector types increases design complexity and maintenance requirements. Each connector family requires different mating hardware, insertion tools, and spare parts inventory. Unless interfacing with legacy systems or addressing specific technical requirements, standardising on a single connector family simplifies manufacturing and field support.

    Working with the Right Supplier

    Comparing backplane connectors involves evaluating technical specifications alongside practical considerations like availability and long-term support. Whether you need Harting's DIN 41612 solutions, ITT Cannon's ruggedised industrial connectors, TE Connectivity's power distribution options, or Molex's versatile connector families, selecting components from established manufacturers ensures proven performance.

    At TRX Electronics, we maintain access to more than 3.2 million product lines through partnerships with world-leading manufacturers including TE Connectivity, Amphenol, ITT Cannon, Molex, and Harting. Our weekly backorder reports and prompt quote turnaround times help keep your projects on schedule.

    Need assistance comparing backplane connector modules for your next design? Contact our technical team.

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