Heat Sinks Thin-Fin Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 50.8x12.7x12.7mm
Products specifications
|
Product
|
Heat Sinks |
|
Height
|
0.33 mm |
|
Designed for
|
BGA, PGA, QFP |
|
Heatsink Material
|
Copper |
|
Width
|
12.7 mm |
|
Mounting Style
|
Adhesive |
|
Length
|
50.8 mm |